S360
34,900
USD
*excluded VAT
NEW
WHAT’S DIFFERENT:
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Xtra-Dimensional-Printing (XDP): Print up to 30% faster in 25-38 micron resolution
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Increased productivity, Reduced printing cost without compromising on quality
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XY resolution at 5,000 DPI and Z resolution at 8,000 DPI
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Wax-based casting allows operating at shorter production time at lower temperatures
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Drag and Drop printing, no need to waste time on support generation
The Solidscape S360 is optimized for higher versatility.
PRINTING PROPERTIES
Layer Thickness :
Print resolution x, y :
Accuracy :
Surface Finish :
Start Process :
Status Monitoring :
Calibration Capacity :
User Selectable - 0.00635 mm to 0.0381 mm ( 6 - 38 microns)
5000 X 5000 dots/inch (197 X 197 dots/mm) in X, Y
±0.005 inch (127 µm) for 1st inch (25.4 mm), ±0.001 inch/inch (25.4 µm each additional inch X,Y, and Z
Up to 32 micro-inches (RMS), geometry dependent
Fully automated, one-touch operation
Fully automated fault detection, restarts build from point of interruption
Efficient calibration and optional user-selectable frequency
TECHNICAL SPECIFICATIONS
Dimensions :
Build Envelope LxWxH :
Weight :
Power :
Operating Temperature :
Humidity :
Agency Compliance :
21.4 x 18 x 16 inches (558 x 495 x 419 mm)
6 x 6 x 4 inches (152.4 x 152.4 x 101.6 mm)
80 lbs (36 kg)
100-240 V Required
60° to 75°F (16° to 24°C)
40-60%
CE Certified, FCC Class B approved, TUV certified EN 60950 Compliant
MATERIAL PROPERTIES
Proprietary model material formulated for clean burnout,
producing 100% direct casting results
Proprietary support material engineered to dissolve completely for superior surface finish
Larger tanks require less filling and allow for longer print run
Display indicates build and support material levels accurately in 10% increments
Midas® Castable Material :
Melt® Dissolvable Support :
Material Capacity :
Material Monitoring :
SOFTWARE AND SYSTEM REQUIRMENTS
One-Click Software :
CAD File Input :
System :
Intuitive software for support calculation and object printing
.stl and .slc files
Window, PC-to-printer connectivity via high-speed USB 2.0 or Ethernet