S360
34,900
USD
*excluded VAT
NEW
WHAT’S DIFFERENT:
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Xtra-Dimensional-Printing (XDP): Print up to 30% faster in 25-38 micron resolution
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Increased productivity, Reduced printing cost without compromising on quality
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XY resolution at 5,000 DPI and Z resolution at 8,000 DPI
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Wax-based casting allows operating at shorter production time at lower temperatures
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Drag and Drop printing, no need to waste time on support generation
The Solidscape S360 is optimized for higher versatility.
PRINTING PROPERTIES
Layer Thickness :
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Print resolution x, y :
Accuracy​ :
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Surface Finish :
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Start Process :
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Status Monitoring :
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Calibration Capacity :
User Selectable - 0.00635 mm to 0.0381 mm ( 6 - 38 microns)
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5000 X 5000 dots/inch (197 X 197 dots/mm) in X, Y
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±0.005 inch (127 µm) for 1st inch (25.4 mm), ±0.001 inch/inch (25.4 µm each additional inch X,Y, and Z
Up to 32 micro-inches (RMS), geometry dependent
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Fully automated, one-touch operation
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Fully automated fault detection, restarts build from point of interruption
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Efficient calibration and optional user-selectable frequency
TECHNICAL SPECIFICATIONS
Dimensions :
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Build Envelope LxWxH :
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Weight :
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Power :
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Operating Temperature :
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Humidity :
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Agency Compliance :
21.4 x 18 x 16 inches (558 x 495 x 419 mm)
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6 x 6 x 4 inches (152.4 x 152.4 x 101.6 mm)
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80 lbs (36 kg)
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100-240 V Required
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60° to 75°F (16° to 24°C)
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40-60%
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CE Certified, FCC Class B approved, TUV certified EN 60950 Compliant
MATERIAL PROPERTIES
Proprietary model material formulated for clean burnout,
producing 100% direct casting results
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Proprietary support material engineered to dissolve completely for superior surface finish
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Larger tanks require less filling and allow for longer print run
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Display indicates build and support material levels accurately in 10% increments
Midas® Castable Material :
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Melt® Dissolvable Support :
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Material Capacity :
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Material Monitoring :
SOFTWARE AND SYSTEM REQUIRMENTS
One-Click Software :
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CAD File Input :
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System :
Intuitive software for support calculation and object printing
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.stl and .slc files
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Window, PC-to-printer connectivity via high-speed USB 2.0 or Ethernet